Minutes, IBIS Quality Committee 20 July 2010 11-12 AM EST (8-9 AM PST) ROLL CALL Adam Tambone Anders Ekholm, Ericsson Barry Katz, SiSoft Benny Lazer Benjamin P Silva Bob Cox, Micron * Bob Ross, Teraspeed Consulting Group Brian Arsenault David Banas, Xilinx * Eckhard Lenski, Nokia Siemens Networks Eric Brock Guan Tao, Huawei Technologies Gregory R Edlund Hazem Hegazy Huang Chunxing, Huawei Technologies John Figueroa John Angulo, Mentor Graphics Katja Koller, Nokia Siemens Networks Kevin Fisher Kim Helliwell, LSI Logic * Lance Wang, IOMethodology Lijun, Huawei Lynne Green, Green Streak Programs * Mike LaBonte, Cisco Systems Mike Mayer, SiSoft * Moshiul Haque, Micron Technology Muniswarareddy Vorugu, ARM Ltd Pavani Jella, TI Peter LaFlamme Randy Wolff, Micron Technology Radovan Vuletic, Qimonda Robert Haller, Enterasys Roy Leventhal, Leventhal Design & Communications Sherif Hammad, Mentor Graphics Tim Coyle, Signal Consulting Group Todd Westerhoff, SiSoft Tom Dagostino, Teraspeed Consulting Group Kazuyoshi Shoji, Hitachi Sadahiro Nonoyama Everyone in attendance marked by * NOTE: "AR" = Action Required. -----------------------MINUTES --------------------------- Mike LaBonte conducted the meeting. Call for opens and IBIS related patent disclosures: - No one declared a patent. AR Review: - Mike contact Antonio Orlandi about problems using FSV1D - Lance was able to reproduce the problem on WinXP - Mike sent an email late New items: Mike: We need to revisit our goals - Bob: If the FSV1D tool is unreliable that diminishes it's usefulness - We might contact them in Europe next year - The freely available status of the tool is uncertain - We also have the method put forward by David and Roy - Mike: The fix may be easy - The response may help determine the free status Mike showed the FSV1D manual: - Mike: In our spec should we use the terms ADM, FDM, GDM? - Bob: No - Mike: How many pages will it take to describe this in our spec? - Bob: We need to mostly reference their tool - Mike: We should show: - Input TD data - FFT - 6 bar graphs - Bob: The numerics are divided between DC shift and higher freq effects - Mike: Would a +10mV high offset and a -10mV low offset come out as zero? - Bob: No they use the absolute difference Mike: We should allocate ARs to write material for the spec - Mike: For example someone could write the Recommended Test Fixtures - Bob: Physical or simulation? - We may not want to go into - Mike: Arpad ran tests showing that IBIS waveform fixtures matter - Lance: I have experience using Arpad's IBISCenter model - In some cases point reduction caused correlation problems - The problems will be at the turning areas where transitions begin and end - Bob: Had the same experience - You can't have 2 points making a straight line - The tools don't model it right - It is best to add intermediate points even if it is linear - Mike: You also should not need 40 points all on a straight line - The curve fitting mostly needs to know it becomes straight at the ends - Bob: This is not always a curve fitting issue - Mike: They form a spline model - The coefficients of the 3 I/V curves directly add up - Bob: This mucks up the effective impedance - Mike: This is more of an Accuracy Handbook discussion - Moshiul: It is mostly up to the developer - They might use the timing test load, for example - Mike: That is a good load to use because it will be simulated to get timing - Moshiul: You also should have some kind of transmission line in there Mike: Maybe the FSV1D tool could be enhanced to read Golden Waveforms - Bob: The may not have a student free to do that work Mike showed the outline for our correlation spec - Mike: This outline may need some rework to be more useful to us - It was developed some time ago by Pavani and me - Parts of it are not clear at this point - For example, do we need a section for package correlation? - It might be best for two of us to work on this between meetings AR: Moshiul and Mike meet to improve the correlation spec outline Next meeting will be August 3 Meeting ended at 12:01 PM Eastern Time.